Tekmos 生产定制集成电路，可在满足客户需求的同时降低成本。这些解决方案的范围从降低现有应用的大量成本到减少过时零件的更换，再到创造全新的产品。Tekmos 是以下市场的芯片解决方案的无晶圆供应商：消费电子、航空航天、汽车、国防、工业和医疗。Tekmos 是定制模拟和混合信号集成电路 (IC) 解决方案行业的领导者，拥有超过 900 种设计。您的想法，Tekmos 的设计。Tekmos 做你需要的。

Tekmos 可以用低成本的 ASIC 替换您现有的大部分系统。Tekmos 负责对您的系统进行分区、创建和实施设计，然后以任何所需的数量制造芯片。

Tekmos 通过从原始布局中提取原始原理图来生成旧零件的精确副本。该设计被转换为 Verilog，并重新模拟以确保它在所有条件下都能正常工作。然后用现代技术重新实现它，为未来的需求提供可靠的来源。

可以将多个裸片放在一个封装中。 Tekmos 使用这种方法将不同的技术组合到一个产品中。例如，Tekmos 可以将 3 伏闪存与 5 伏 ASIC 相结合，以模拟过时的 5 伏微处理器。在统一计划下，Tekmos 还可以将多达 9 种不同的芯片组合在一个封装中。此功能适用于物理尺寸至关重要的应用，例如戒指或口腔医疗设备。

用 SOI CMOS 制造的器件结面积减小，因此可以在高达 300ºC 的温度下工作。 Tekmos 使用这项技术来支持高温应用，例如井下石油勘探、喷气发动机和某些工业应用。Tekmos 还支持使用块状硅器件制造的其他高达 200ºC 的高温应用。

Tekmos 位于德克萨斯州奥斯汀，自 1997 年以来一直是全球数百家公司的可靠 ASIC 供应商。Tekmos 已通过 AS9100D 认证，并为关键的医疗和国防项目提供设备。


Tekmos produces custom integrated circuits that will reduce costs while meeting the needs of our customers. These solutions range from high volume cost reductions for existing applications, to drop in replacements for obsolete parts, to creating entirely new products. Tekmos is a fabless provider of chip solutions across these markets: Consumer Electronics, Aerospace, Automotive, Defense, Industrial, and Medical. Tekmos is leaders in the industry of custom analog and mixed-signal Integrated Circuit (IC) solutions with over 900 designs. Your ideas, our designs. We make what you need.

Tekmos can replace much of your existing system with a low cost ASIC. Tekmos does the work of partitioning your system, creating and implementing the design, and then manufacturing the chips in any desired volume.

Tekmos produces exact copies of legacy parts by extracting the original schematic from the original layout. The design is converted into Verilog, and resimulated to ensure that it will work correctly in all conditions. Then it is re-implemented in a modern technology, providing a reliable source for future requirements.

It is possible to put multiple die in a single package. Tekmos uses this approach to combine different technologies into a single product. For example, Tekmos can combine a 3-volt flash with a 5-volt ASIC to emulate an obsolete 5-volt microprocessor. Tekmos can also combine up to 9 different chips in a single package under our Unify program. This capability is for applications where physical size is paramount, such as in a ring, or in an oral medical device.

Devices made with SOI CMOS have reduced junction areas, and so can operate at up to 300ºC. Tekmos uses this technology to support high temperature applications such as down-hole oil exploration, jet engines, and certain industrial applications. Tekmos also supports other high temperature applications up to 200ºC made with bulk silicon devices.

Located in Austin, Texas, Tekmos has been a reliable source of ASICs for hundreds of companies worldwide since 1997. Tekmos is AS9100D certified, and has supplied devices for critical medical and defense projects.