Shanghai Belling Co., Ltd. is located in Caohejing Development Zone, Shanghai. This development zone is the only one to integrate state-level technology development zone, high-tech industrial development zone, and export processing zone.
On June 21, 1985, integrated circuit production line project broke earth; on Sep. 10, 1998, the company was founded. Shanghai Belling’s growing up boosted China’s integrated circuit development into a new stage. On Sep. 24, 1998, Shanghai Belling became the first listed company in the microelectronics industry of China and is dedicated to the society and all the shareholders with sincerity.
The target company majors in IC design and development, taking manufacture as its support. It designs and manufactures IC by itself and creates self-owned intellectual property right. It has applied and been authorized over 220 intellectual property rights since its foundation in 2002.
In 2002, awarded as Shanghai Industrial Enterprise Intellectual Property Right Advanced Unit.
In 2004, bi-electrode integrated circuit won the first prize of Shanghai invention patent.
In 2005, awarded as the first group of Shanghai Intellectual Property Right Model Units (Cultivated enterprises)
Its business development is positioned on Niche IDM, namely, the company is a product and service supplier combining product design and special process manufacture, closely cooperating with manufacturers of the entire machine system, forming an industrial chain from chip processing, design, and application to system design and providing all-round solutions to customers. Develop into a large-scale group company covering product design and development, silicon chip processing and upstream and downstream enterprises and extended relevant industries by production operation and capital operation, hold and keep on creating new competitive advantages. Actively develop international market when continuing to enlarge domestic market shares.
In the coming years, Shanghai Belling will commit itself to developing telecommunication circuit, display drive circuit, security circuit, electrical energy measurement circuit in the electronic information field and double-interface card, biological information card, remote electronic label, advanced power supply management circuit and disjunction parts in the smart card field and implanted system on-chip (SOC) in the MCU field etc. Process will focus on development of 0.5micron BCD process and 700V high-pressure BiCMOS.